Daniel DockNov 5, 20191 minTraX Introduces Resin filled viasTraX introduces advanced resin filling capability to it's manufacturing capability which will allow the manufacturing of boards requiring...
Daniel DockNov 5, 20191 minAdvanced adhesion technology introduced for high frequency printed circuit boards productionRead the full aerospace industry support initiative impact report here.
Daniel DockSep 10, 20181 minMEC V Bond process commissioned at TraXMec V Bond is a proprietary surface preparation treatment for high frequency printed circuit boards that replaces mechanical brushing and...
Daniel DockNov 11, 20142 minReverse Pulse Plating at TraXEarlier this year TraX started experimenting with reverse pulse plating , to meet the demands of customers requiring high layer count...
Daniel DockNov 4, 20141 minTraX embarks on Technology upgradeTraX is proud to announce that we have embarked on a strategic upgrade of our plant to enable us to meet the ever increasing technology...
Daniel DockOct 8, 20132 minTraX Introduces ASIG final finish, for improved RF performanceWhat is ASIG: “ASIG” or Autocatalytic Silver Immersion Gold, is a final finish for pcb’s that is supplied by DOW. It was released to the...