Earlier this year TraX started experimenting with reverse pulse plating , to meet the demands of customers requiring high layer count pcb's . One of the biggest challenges with high layer count pcb's is that the vias connecting all the layers require a high aspect ratio. With traditional DC plating we have been able to achieve an aspect ratio of 6,4 : 1 but with reverse pulse plating aspect ratios as high as 14 : 1 are theoretically possible and our testing thus far confirms