
Resin Filled via specifications
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TraX is able to resin fill through holes and blind vias according to customer requirements. Where required the vias can be capped with copper to make component pads.
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The Epoxy Fill will be non-conductive Taiyo THP-100DX1, which is a single component, thermally curable, permanent hole filling material. Technical data sheet is available on our downloads section.
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The Epoxy Fill is High Tg and low CTE. It is Halogen Free and RoHS Compliant.
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Aspect Ratio for through holes will be 1:10 and blind vias 1:0.8
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Board thicknesses to be resin filled will range from 0.2mm to 4.0mm
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Manufacturing data pack should include a gerber layer indicating all holes which require resin filling.
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Our Copper Cap plating will be in accordance to IPC-6012D 3.6.2.11.2
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Our Epoxy fill will be in accordance to IPC-6012D 3.6.2.1