Resin Filled via specifications

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• TraX is able to resin fill through holes and blind vias according to customer requirements. Where required the vias can be capped with copper to make component pads. 

• The Epoxy Fill will be non-conductive Taiyo THP-100DX1, which is a single component, thermally curable, permanent hole filling material. Technical data sheet is available on our downloads section.

• The Epoxy Fill is High Tg and low CTE. It is Halogen Free and RoHS Compliant.

• Aspect Ratio for through holes will be 1:10 and blind vias 1:0.8

• Board thicknesses to be resin filled will range from 0.2mm to 4.0mm

• Manufacturing data pack should include a gerber layer indicating all holes which require resin filling.

• Our Copper Cap plating will be in accordance to IPC-6012D 3.6.2.11.2

• Our Epoxy fill will be in accordance to IPC-6012D 3.6.2.1

 

 

 

 

 

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