Surface Finishes

Tin-Lead

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Tin lead, selectively applied over bare copper by "Hot Air Solder Levelling".

 

Electroless Nickel / Immersion Gold (ENIG)

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The Rohm and Haas process are used. This is also offered as a finish for very flat requirements such as BGA pads. Deposit thickness are to IPC-4552: Nickel 3.5 to 6.3µM and Gold 0.05 to 0.12µM.

 

Autocatalytic Silver Immersion Gold (ASIG) 

 

Silver is 0.15µM minimum and Gold is 0.03µM minimum.                                                                                                               

Electroplated Gold over Nickel (for edge connectors)

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1 micron of electroplated hard gold alloy over 3 microns of electroplated nickel.

 

Peelable Soldermask

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Red peelable mask is applied by silkscreen to selectively mask circuit features as required.