Surface Finishes


Tin lead, selectively applied over bare copper by "Hot Air Solder Levelling".

Lead free Hasl will be available from August 2022


Electroless Nickel / Immersion Gold (ENIG)

The Rohm and Haas process are used. This is also offered as a finish for very flat requirements such as BGA pads. Deposit thickness are to IPC-4552: Nickel 3.5 to 6.3µM and Gold 0.05 to 0.12µM.


Autocatalytic Silver Immersion Gold (ASIG) 


Silver is 0.15µM minimum and Gold is 0.03µM minimum.                                                                                                               

Electroplated Gold over Nickel (for edge connectors)

1 micron of electroplated hard gold alloy over 3 microns of electroplated nickel.